Extended Data Fig. 6: Interface wettability and service stability of colloidal LMs. | Nature Nanotechnology

Extended Data Fig. 6: Interface wettability and service stability of colloidal LMs.

From: Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels

Extended Data Fig. 6

a, Surface free energy (γs) of colloidal LMs, where γsd is the dispersion component and γsp is the polar component. LM performs a surface free energy of about 47.3 mJ/m2 after the trance of surface oxidation. For colloidal LMs, the dispersion component dominates the value of surface free energy, and the reduction in the dispersion component obviously changes the surface free energy of colloidal LMs. b, Image of the initial contact angle of colloidal LMs. c, Surface free energy of different substrates. d, Image of the initial contact angle of colloidal LM with different substrates. The colloidal LM denotes the sample containing 42.5 vol% AlN (30 µm). e-g, SEM images showing the conformability of the colloidal LMs with two copper plates at different rheological states. h, Reff results of the colloidal LM under different sandwiched pressures. The particles used are 30 µm AlN with a volume content of 42.5%. Notably, when the pressure reached or exceeded 40 psi, the Reff remained nearly constant, attributed to the BLT approaching its theoretical limit, which corresponds to the maximum particle diameter value. i-j, Comparison of the interface thermal properties between the LM/AlN composite (sample 1, without gradient infiltration of LM at the AlN–LM interface region) and colloidal LM (sample 2). Both samples contain AlN particles with a diameter of 30 µm and a volume content of 45%. In c, h, i, and j, the data points and error bars show the mean ± s.d. (sample size 3).

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