Extended Data Fig. 9: Theoretical simulations for high-power thermal management.
From: Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels
a, Model diagram illustrating the simulation of high-throughput heat dissipation in the large-scale thermal management system. b, Simulated temperature distribution profiles of the heat source under the different conditions of heat flux, at a coolant volume flow rate of 2.1 L/min. c, Comparison of the average temperature results between the experiment and simulation. d, Simulated temperature distribution profiles of the heat source under the different conditions of heat flux, at a coolant volume flow of the maximum 5.0 L/min. e, Simulated average temperature results of the heat source under the different conditions of heat flux. In c and e, the data points of the simulations were obtained from the temperature distribution results in b and d.
