Extended Data Fig. 4: STEM results of integrated Au/BP/Au device.
From: On-chip optoelectronic logic gates operating in the telecom band
(a) SEM picture of Au/BP/Au device from the top view. (b) Cross-section scanning transmission electron microscope (STEM) image of Au/BP/Au device. (c) The thickness of BP is approximately 11.7 nm. (d) Enlarged STEM image of Au/BP/Au device.
