Extended Data Table 2 Measurement of the loss for each component of the MZM, allowing to extract the contribution to the insertion loss from the Si-PIC PDK and the back-end integration process

From: A high-speed heterogeneous lithium tantalate silicon photonics platform

Label

Component

Loss in the MZM

C1

MMI splitters

0.8 ± 0.2

C2

Si routing inside MZM

3.0 ± 0.4

C3

Transitions (Si to SiN/LiTaO3)

0.6 ± 0.2

C4

EO section (SiN/LiTaO3)

0.7 ± 0.3

C5

Metal misalignment

1.6 ± 0.1

  1. Measurement of the loss for each component of the MZM, allowing to extract the contribution to the insertion loss from the Si-PIC PDK (C1 and C2) and the back-end integration process (C3, C4 and C5).
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