Extended Data Fig. 8: Structure of the integrated full-bridge rectifier with embedded cooling.
From: Co-designing electronics with microfluidics for more sustainable cooling

a, Three PCBs that provide coolant delivery to the chip. b, Laser-cut adhesives used to bond the layers together. c, Converter after assembly, with electrical and fluidic connections. d, SEM image of the four-diode structure. The inset shows the polarity of each device and a close-up of the structure of the tri-anode Schottky barrier diode.