Extended Data Fig. 3: Example data reduction of thermal characterization experiments for the 10×-manifold chip.
From: Co-designing electronics with microfluidics for more sustainable cooling
a, Peak surface temperature rise above the inlet temperature, measured using infrared thermography at varying power dissipation. The slope of the linear fit through the data points gives the total thermal resistance (Rtotal). b, Water temperature rise, measured between the inlet and outlet of the chip. The slope of the linear fit through the data points gives the contribution of the total thermal resistance due to the temperature rise of the water (Rheat). c, Wall temperature rise. The slope through these data points gives the convective thermal resistance. d, Total, caloric, convective and conductive thermal resistance versus the inverse flow rate. e, Nusselt number and fin efficiency. f, Effective base-area averaged heat transfer coefficient (heff) and wall-area averaged heat transfer coefficient (hwall), taking the surface area of the microchannels as well as the fin efficiency into account.
