Extended Data Fig. 4: Overview of derived values of the thermo-hydraulic analysis.
From: Co-designing electronics with microfluidics for more sustainable cooling
a, Wall temperature for all devices. Each device shows a distinct slope in wall temperature rise versus power dissipation. b, Caloric thermal resistance for all evaluated flow rates, showing a clear (ρcpf)−1 relationship over all devices. c, Fin efficiency over a range flow rates. d, Nusselt number versus inverse flow rate. The dashed line indicates that Nu = 3.66 for fully developed internal flow.
