Extended Data Fig. 2: Electro-mechanical performance of BIND interface depends on evaporation rate and thickness.

a, b, Graph (a) and contour map (b) show the electrical stretchability of a single BIND interface as a function of evaporation rate and thickness. At the lowest evaporation rate (0.1–0.2 Å/s) and thickness (45 nm), a non-conductive interface is obtained. As evaporation rate or thickness increases, electrical stretchability peaks before decreasing to ~40%. c, d, Graph (c) and contour map (d) show the electrical stretchability of soft-soft BIND connection as a function of evaporation rate and thickness is similar to the single BIND interface in a and b. Only a limited combination of evaporation rate (0.5–1.0 Å/s) and thickness (45–60 nm) forms the BIND connection. Lower rates and thicknesses result in non-conductive connection while higher ones form non-adhesive interfaces. e, f, Graph (e) and contour map (f) show the mechanical stretchability of soft-soft BIND connection decreasing monotonically with increasing evaporation rate and thickness. Error bars in a, c, e are s.d. from 3–5 samples.