Fig. 1: Manufacturable integrated quantum photonic stack.
From: A manufacturable platform for photonic quantum computing
a,b, Schematics of key components and process modules. We highlight (on the right) further process steps included in our next-generation platform. c, A 300-mm wafer containing single-photon sources, superconducting single-photon detectors and quantum benchmarking circuits. d, A cryogenic assembly containing a photonic die, heat spreader, electronic PCB and 100-channel telecommunications fibre attach unit. e–j, Optical micrograph, scanning electron microscope or transmission electron microscopy images of: photon source (top-down) (e); optical waveguide (cross-section) (f); deep/shallow trench scattered light shield (cross-section) (g); single-photon detector (top-down) (h); thermal isolation trench (cross-section) (i); single-photon detector on waveguide (cross-section) (j). k, Custom cryostat used in benchmarking experiments with >10 W cooling power at 2.2 K. Scale bars, 20 μm (e,h), 1 μm (f,i), 10 μm (g), 40 nm (j). AMZI, asymmetric Mach–Zehnder interferometer.
