Extended Data Fig. 3: Plausible EMI shielding mechanisms in multilayered films.
From: Electromagnetic interference shielding using metal and MXene thin films
a, Reference case of a non-porous, homogeneous, and conductive Cu film. Surface reflection, internal absorption, and multiple reflections occur when the film thickness is less than the skin depth (i.e., electrically thin). Note that multiple reflections can reduce shielding effectiveness due to an increase in transmitted wave power. b-d, Cases of electrically thin, multilayered films. EXIM shield: Cu/MXene/Cu sandwich structure (b), top-MXene/bottom-Cu bilayer (c), and top-Cu/bottom-MXene bilayer (d). The electrical conductivities of Cu and MXene films were set to the experimentally measured values in this work.
