Table 4 Comparison between the present and previously reported data related to the DBTT of tungsten-based materials.

From: Nanostructured laminar tungsten alloy with improved ductility by surface mechanical attrition treatment

Material/Size

Working process

DBTT(K)

Dimension(mm)

Method

Ref.

WL10

Swaging + Rolling + SMAT

≤723

27 × 4 × 3

Charpy

our

WL10

Swaging + Rolling

973

27 × 4 × 3

Charpy

our

WL10

Swaging + Rolling

973

10 × 10 × 55

Charpy

28

W − 0.5 ZrC (8.5 mm thick plate)

Rolling

373

2 × 2 × 20

3PB

29

W − 2 Y2O3 (2 mm thick, Φ 95 mm)

Hot Forging

473

2 × 2 × 25

3PB

30

Pure W (10 mm thick plate)

Rolling

473

2 × 4 × 20

3PB

31

Pure W (4 mm thick)

HIP

473

2 × 3.3 × 20

3PB

31

W − 0.2 TiC (1 mm thick)

Forging + Rolling

440

1 × 1 × 20

3PB

32

W − 0.25 Ti−0.05 C (1 mm thick plate)

Rolling

260

1 × 1 × 20

3PB

32

W − 1% Y2O3

Injection molding

1273

3 × 4 × 27

Charpy

33

Pure W

Injection molding

1173

3 × 4 × 27

Charpy

33

W − 0.5 TiC

HIP + Forging

484

1 × 1 × 20

3PB

34

Pure W (0.1 mm thick foil)

Rolling + Joining

373

4 × 15 × 33

Charpy

35