Figure 1 | Scientific Reports

Figure 1

From: Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

Figure 1

The reconstructed cross-sectional laminography images at the UBM/solder interface before (initial state) and after EM testing for 300 hours (on the top and the bottom, respectively). The solder material is visible in gray and the voids in black. In the middle: 3D rendition of the top portion of the solder joints, showing the evolution of discrete voids as a function of EM testing time; the solder outline is rendered in semi-transparent gray while the voids are in magenta.

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