Figure 12
From: Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
(a) The schematic cross-sectional view (XZ) and (b) the plane view (XY) of the sample structure; the enlarged image of the dashed rectangular region in (a) for (c) Cu-SN-L, Cu-SAC-L and -H samples and for (d) Ni-SN-L and -H samples, which are the major regions of interest in our study.
