Table 1 The DZ* of all samples obtained from mass transportation and the slope of the lines in Fig. 2(c).
From: Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
Sample | UBM | Solder | DZ* (cm2/s) | Slope | Error of Slope |
|---|---|---|---|---|---|
Cu-SN-L | Ti/Cu/Cu | SN100C | 6.87 × 10−11 | 0.74 | 0.03272 |
Cu-SAC-L | Ti/Cu/Cu | SAC1205 | 1.40 × 10−10 | 0.58 | 0.03215 |
Cu-SAC-H | Ti/Cu/Cu | SAC1205 | 1.15 × 10−10 | 0.48 | 0.02676 |
Ni-SN-L | E-less Ni/Au | SN100C | 4.15 × 10−11 | 0.78 | 0.05844 |
Ni-SN-H | E-less Ni/Au | SN100C | 8.36 × 10−11 | 0.70 | 0.01541 |
