Figure 1 | Scientific Reports

Figure 1

From: Self-Powered Pressure Sensor with fully encapsulated 3D printed wavy substrate and highly-aligned piezoelectric fibers array

Figure 1

(a) Schematic of the near-field electrospinning process to fabricate direct-write PVDF fibers on top of wavy substrate. (b) Mechanical adhesion of wavy substrate with Cu foil as conductive electrode. (c) Electrospun PVDF fibers on top of Cu-adhesive wavy substrate via NFES. (d) Fully encapsulation with PDMS (bottom inset: optical photo and SEM image of PVDF fibers deposited on top of wavy substrate, exhibiting the wavy and 3D topology). Scale bar is 200 μm.

Back to article page