Figure 1 | Scientific Reports

Figure 1

From: Silver oxide decomposition mediated direct bonding of silicon-based materials

Figure 1The alternative text for this image may have been generated using AI.

Weight loss and heat of reaction behaviour during heating to the bonding temperature. (a) TGA-DTA curves for the paste without preheating; the inset shows a photograph of the Ag2O paste used in this study. (b) Shear strength of the joint bonded at 400 °C after preheating at 100 °C for various holding times. (c–e) TGA-DTA curves for the paste after preheating for (c) 3 min, (d) 9 min, and (e) 13 min, where the positive/negative DTA values refer to exothermic/endothermic reactions, respectively.

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