Figure 7
From: Silver oxide decomposition mediated direct bonding of silicon-based materials
Adhesion behaviour of AgNP onto SiO2 dependent on the interfacial structure of SiO2, determined via molecular modelling. (a) Adhesion process of AgNP onto the SiO2 surface with an embedded atomic Ag layer at d = 1r from the surface. AgNP can adhere to SiO2 with increasing wetting angle owing to the presence of embedded Ag atoms. (b) Desorption process of AgNP from SiO2 with an embedded Ag layer at d = 3r from the surface, showing no attractive force between the AgNP and SiO2 layer. These simulations were performed at 500 °C.
