Figure 1

Solidification structures near the solid-liquid interface in peritectic alloy Cu-10.5 at.% Sn directionally solidified at a temperature gradient of 100 K/cm and various growth speeds without and with the application of a 0.7 T transverse static magnetic field: (a) 0.5 μm/s; (b) 2 μm/s; (c) 5 μm/s; (d) 50 μm/s.