Figure 2
From: Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
Cross-sectional SEM/FIB images of electroplated (a) nt-Cu bump, (b) nt-Cu thin film; cross-sectional SEM/FIB images of post-CMP (c) nt-Cu bump, (d) nt-Cu thin film; and AFM scanning results for (e) nt-Cu bump, (f) nt-Cu thin film.
