Figure 8
From: Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
Characterization of the bonding interface between the bonded nt-Cu and bonded polycrystalline Cu: cross-sectional TEM images of the (a) bonded nt-Cu joint and (b) bonded polycrystalline Cu joint; the grain growth behavior and bonding interface condition for (c) bonded nt-Cu joint and (d) polycrystalline Cu joint; and the cross-sectional HRTEM images of the bonded interface and corresponding diffraction patterns for (e) bonded nt-Cu joint and (f) bonded polycrystalline Cu joint.
