Figure 3 | Scientific Reports

Figure 3

From: Electrodeposited metal-organic framework films as self-assembled hierarchically superstructured supports for stable omniphobic surface coatings

Figure 3

Comparison of the surfaces of electrochemically modified and native Cu foils. (a–c) XRD patterns and (d–f) SEM images of (a,d) an electrodeposited Cu-BTC framework film on Cu foil and results of the structure analysis (using the structure model of HKUST-136, red: calculated pattern, green: Bragg positions, blue: difference plot), (b,e) a Cu foil anodised in an electrolyte not containing linker molecules and reference patterns (Cu2O Pn-3m71, CuO C2/c72) and (c,f) a native Cu foil and reference patterns (CuO as in b). The scale bars are (d–f) 10 µm.

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