Figure 2 | Scientific Reports

Figure 2

From: A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices

Figure 2

Optical layout and photographic view of the proposed method: (a) optical layout of the proposed method (Details of the polarization state are shown in Fig. A.1 of Appendix-A.), (b) photographical top view, and (c) side view of the experimental setup. (CL: collimation lens, P1, P2 and P3: polarizers, PBS: polarizing beam splitter, NBS: non-polarizing beam splitter, QWP1 and QWP2: quarter-wave plates, M: mirror, DM: dichroic mirror, TM: turning mirror, IL: imaging lens, OL: objective lens, PD: photo-detector, \(\overrightarrow{{\bf{E}}}\): resultant electric field vector, \({\overrightarrow{{\bf{E}}}}_{{\rm{s}}}\): s component of the electric field vector, \({\overrightarrow{{\bf{E}}}}_{{\rm{p}}}\): p component of the electric field vector).

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