Figure 3 | Scientific Reports

Figure 3

From: Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds

Figure 3The alternative text for this image may have been generated using AI.

(a) Bright-field cross-sectional TEM image of the interface soldered with ultrasonic action for 0.1 s; (b) high-resolution TEM (HRTEM) image of the interface, and the inset was obtained by fast Fourier transform (FFT) of the white rectangular area; (c) HAADF image of the orange range in (a) and the corresponding STEM-EDS maps of (d) Si, (e) Ti, (f) O, (g) Sn, and (h) Ag.

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