Figure 4
From: Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds
(a) High-resolution TEM image of the interface soldered with ultrasonic action for 1 s, and the inset was obtained by FFT of the white rectangular area; (b) HAADF image of the interface and the corresponding STEM-EDS maps of (c) Ti, (d) O, (e) Si, (f) Sn, and (g) Ag.
