Figure 6

In situ HEXRD result of the sample that was triggered at ΔT = 163 K. (a) Temperature-time profile of the continuous exposure experiment; (b) two-dimensional diffraction patterns captured by PE panel with 0.5 s exposure time. (c) The integrated HEXRD diffraction pattern showing the solidification path during this undercooled solidification process. These patterns are stacked from bottom to top in sequence of elapsing time. In order to better refer to powder diffraction data as shown in Fig. 5(a), the diffraction angle obtained by synchrotron radiation X-ray (wavelength λ = 0.017199 nm) was transformed into standard Cu-target X-ray (wavelength λ = 0.15406 nm) diffraction angle by using formula:\(\,\frac{{\sin {\rm{\theta }}}_{1}}{{{\rm{\lambda }}}_{1}}=\frac{{\sin {\rm{\theta }}}_{2}}{{{\rm{\lambda }}}_{2}}\).