Figure 5
From: Gate-tunable graphene-based Hall sensors on flexible substrates with increased sensitivity
Bending tests for flexible Hall sensor. (a) Optical photograph of the flexible chip after it has been peeled off from Si substrate. (b) Bending cycle dependent measurement of the Hall sensor sensitivity. The PI substrate has been bent under bending radii of 6.4 mm up to 1000 times. The inset shows the measured Sv before and after bending tests with different bending radii of 25.4 mm, 12.7 mm, and 6.4 mm. The measurements have been carried out in flat status before and after bending at constant VC of 300 mV and VG of −1.2 V.
