Table 2 Membranes fabricated with lithography assistance.

Ogura et al.¹¹

Silicon Nitride

1–1.8

N/A

N/A

Si₃N₄ deposition, electron beam lithography, plasma etching

Vaeth²⁹

Silicon

3–5

40

1.62

Deposition, hard mask lithography, fluid channel lithography, etching

Warkiani et al.³⁰

Metal

2.5 × 8

N/A

78.5

Multilevel UV-lithography, electroplating

Carter et al.³¹

Glass (SiO₂)

0.5, 3

N/A

14

SiO₂ deposition, photolithography, RI etching

Salminen et al.³²

Silicon Nitride

3

N/A

-

Lithographic laser writing, RI etching

Brauker et al.¹²

Polyimide

20

2–5

1

Polyimide nonporous film formation, lithography, oxygen curing

Zheng et al.¹³

Parylene

10

10

0.36

Dense Parylene film formation, O₂ plasma, etching

Huh et al.²⁰

PDMS

10

30

2

Soft lithography, wet etching

Hosokawa et al.³³

PET

4–2

60

4

Photolithography-based electroforming

Xu et al.¹⁴

Parylene

6

N/A

0.36

Dense Parylene film formation, Cr/Al deposition, wet etching

Warkiani et al.¹⁸

SU-8 photoresist

3 × 12

2–4

—

UV-lithography, epoxy (SU-8) photopolymerization

Chen et al.²¹

PDMS

4–20

8–200

9

O₂ plasma, photolithography, dry RI etching

Harouaka et al.¹⁵

Parylene

4–7

N/A

0.5

Dense Parylene film formation, photolithography, etching

Kim et al.¹⁶

Parylene

0.8–4

N/A

0.42

Dense Parylene film and Ti mask formation, photolithography, dry etching

Tang et al.³⁴

PEGDA

5.5–8

24

0.81

Photolithography, molding

Zhou et al.¹⁷

Parylene

8

12

1

Dense Parylene film formation, lithography, aluminum etching

Adams et al.¹⁹

SU-8 photoresist

5–9

20

<0.64

Dense epoxy-based film formation, photolithography

Musah et al.²²

PDMS

7

30

N/A

Soft lithography, wet etching

This work

Mylar_, Kapton

0.7–50

2–50

38.5

Mylar and Kapton dense films patterned by photolithography and dry RI etching. For submicron pores, a CVD step was added.