Figure 6 | Scientific Reports

Figure 6

From: Conductive Highly Filled Suspensions for an Electrochemical Dispensing Approach to Pattern Full-Area Thin Metal Layers by Physical Vapour Deposition

Figure 6The alternative text for this image may have been generated using AI.

Radar diagrams are used to evaluate the overall performance of a dispensing paste in terms of potential throughput rate, etched line width and capabilities to etch thick aluminum layers. On the left and in the center, the performance of paste A and B for different mass shares of SiC particles are shown, indicating a better printing performance with increased mass share of SiC particles. However, overall electrical conductivity suffers from increased mass share.

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