Figure 1

Fabrication process of the suspended Cu channel: (a) make a hole and refill it with Al, (b) fabricate an LSV on top of the previously deposited Al, and (c) remove the Al via TMAH aq. (d) An AFM image of the LSV with the suspended channel and the measurement setup. The scan range was 5 × 5 μm². A magnetic field H was applied along the long side direction of the Py electrode. The current was injected from one of the Py electrodes, and the voltage was measured with the other electrode. (e) Line profiles of the AFM image. Line #1 and #2 are displayed in (d). Height from the bottom of the hole to the top of the Cu channel was 150 nm, as expected from the depth of the hole (50 nm) and the channel thickness (100 nm).