Figure 4 | Scientific Reports

Figure 4

From: Simultaneous photoadhesion and photopatterning technique for passivation of flexible neural electrodes based on fluoropolymers

Figure 4

(a) The AS between Au and fluoropolymers relative to both the plasma treatment time and the fluoropolymer film thickness. Fluoropolymers were treated at an RF power of 40 W under working pressure of 15 mTorr. (b) Effect of RF sputtering power on the AS between Au and a non-treated 127-Îĵm thick FEP film. RF sputtering power was applied in a two-step mode. Up to a nominal thickness of 20 nm, RF power in the range of 20–200 W was applied; afterward the RF power was switched to 50 W and maintained up to a nominal thickness of 200 nm. The RF sputtering power denotes that applied during the first step.

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