Figure 5 | Scientific Reports

Figure 5

From: Simultaneous photoadhesion and photopatterning technique for passivation of flexible neural electrodes based on fluoropolymers

Figure 5

(a) Cross-sectional transmission electron microscopy (TEM) images of the Au-FEP interface with respect to plasma treatment time. The FEP was plasma treated at an RF power of 40 W, and Au was deposited at an RF sputtering power of 50 W. (b) Cross-sectional STEM images of the Au-FEP, Au-PFA, and Au-PTFE interfaces. Fluoropolymers did not undergo plasma treatment, and Au was deposited at an RF sputtering power of 50 W. (c) Cross-sectional STEM images of an Au-FEP interface with respect to the RF sputtering power. All images are of a 127-Îĵm thick FEP film.

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