Figure 6 | Scientific Reports

Figure 6

From: A mild aqueous synthesis of ligand-free copper nanoparticles for low temperature sintering nanopastes with nickel salt assistance

Figure 6

Sintering behaviour of the NP paste and characterization of sintering films. (a) Resistivity of sintering films at different temperatures made from pastes of copper particles synthesized with different molar ratios of [NiCl2]/[Cu] (i): 0.1 (Ni-salt-assisted method), (ii): 0. (b) Shear strength of NP pastes obtained at different temperatures by pressure-less sintering under a N2 atmosphere. (c) SEM images of Cu sintering films made from nanopastes on a glass substrate sintered at (i) 150 °C, (ii) 180 °C, (iii) 200 °C, and (iv) 260 °C under a N2 atmosphere for 30 min.

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