Figure 7 | Scientific Reports

Figure 7

From: A mild aqueous synthesis of ligand-free copper nanoparticles for low temperature sintering nanopastes with nickel salt assistance

Figure 7

Characteristics of copper electrode formation on flexible substrates and stability of the copper electrode. (a) LED-mounted Cu electrode obtained by printing CN NP-based nanopastes on a PEN film and the LED emission behaviour. The device was prepared by sintering at 200 °C under a N2 atmosphere for 30 min. (b) A CN NP-based electrode on a PET film obtained after sintering at 150 °C under a N2 atmosphere for 30 min. (c) Time changes in the resistivity of Cu electrodes obtained by sintering at 150 °C, 180 °C, 200 °C, and 260 °C under a N2 atmosphere for 30 min. The Cu electrodes on a glass substrate were kept under ambient atmospheric conditions at 24 ± 1 °C and 44 ± 1% humidity, and the resulting resistivities were measured for the stability test.

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