Table 1 Properties of dimensions and materials of LED package8.
Thickness | Size | Materials | |
|---|---|---|---|
LED-chip | 4 µm | 1 mm × 1 mm | GaN |
Metallization: Bonding Layer | 10 µm | Au–Si eutectic bonding | |
Die | 375 µm | Si | |
Die-attach | 50 µm | Au-20Sn | |
Substrate | 127 µm | 1 cm × 1 cm | Copper |
381 µm | AlN | ||
TIM | 50 µm | 1 cm × 1 cm | Thermal grease |
Heat sink | – | – | Al |
