Table 8 Experimental results of Ni electroplating parameters on: resistivity, surface roughness, thickness, and adhesion.

From: Fabrication of solderable intense pulsed light sintered hybrid copper for flexible conductive electrodes

Expt. no

Factors

Resistivity (μΩ∙cm)

Surface Roughness (Sq) (μm)

Thickness of Ni (μm)

Adhesion

Bath temperature (°C)

Current density (A/dm2)

Time (min)

S-1

40

2

1

38.20

3.90

2.22

3B

S-2

40

2

3

32.36

3.44

3.51

4B

S-3

40

2

5

21.96

3.29

3.82

5B

S-4

40

5

1

29.68

3.28

3.51

4B

S-5

40

5

3

19.01

2.67

5.01

2B

S-6

40

5

5

12.68

2.47

7.35

1B

S-7

40

10

1

32.34

1.67

5.74

0B

S-8

40

10

3

10.54

2.28

6.36

0B

S-9

40

10

5

8.964

2.74

6.55

0B

S-10

60

2

1

45.52

4.56

2.98

5B

S-11

60

2

3

38.01

4.07

4.79

5B

S-12

60

2

5

24.31

3.43

5.63

5B

S-13

60

5

1

30.63

3.57

5.67

5B

S-14

60

5

3

18.27

2.58

7.84

3B

S-15

60

5

5

10.44

2.19

11.46

1B

S-16

60

10

1

14.78

1.45

5.41

5B

S-17

60

10

3

14.23

2.29

10.45

1B

S-18

60

10

5

10.97

2.38

13.23

0B