Figure 4
From: IoT device fabrication using roll-to-roll printing process
Coss-section between the top and bottom conductive layers at the via-holes. (A) Original Epoxy Silver Paste, (B) Epoxy Silver Paste with added flattening agent (C) Diluted Epoxy Silver Paste with 3wt% BCA, and (D) Diluted Epoxy Silver Paste with 12 wt% BCA.
