Figure 7
In the top panel the deposition process is depicted: the stencil masking allows the patterning of cluster assembled film via the interception of the cluster beam. In the bottom one two types of devices and their dimensions are depicted: (a) Two-electrode device, consisting of a couple of gold electrodes bridged by a cluster assembled Au film; (b) Multi-electrode device consisting of one vertical and three horizontal cluster-assembled film stripes linking the six electrodes.
