Figure 4 | Scientific Reports

Figure 4

From: Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

Figure 4

Ion FIB and EBSD images of the Kelvin microbumps bonded at 300 °C/47 MPa/10 s after 1000 thermal cycles: (a, c) as-fabricated and (b, d) post-annealed, respectively. It is obvious in (c) that cracks propagated along the bonding interface. As the original bonding interface was eliminated, no obvious cracks were detected (d). Thus, its electrical resistance was mostly maintained unchanged under thermal cycling.

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