Table 4 Comparison of the mean, the SDs, and the RSDs of the transfer characteristics and the memory performances of the single-layer ADG 1 T-DRAMs and the 3-D stacked ADG 1 T-DRAMs.

From: 3-D stacked polycrystalline-silicon-MOSFET-based capacitorless DRAM with superior immunity to grain-boundary’s influence

   

Single-layer ADG 1 T-DRAM

3-D stacked ADG 1 T-DRAM

Transfer Characteristics

Threshold voltage (Vth)

Mean

1.002 V

0.956 V

SD

15.9 mV

6.5 mV

RSD

1.58%

0.68%

Subthreshold swing (SS)

Mean

115.0 mv/dec

114.2 mv/dec

SD

5.96 mv/dec

0.626 mv/dec

RSD

5.18%

0.55%

On-current (Ion)

Mean

1.87 × 10−4 A/µm

5.74 × 10−4 A/µm

SD

1.45 × 10−5 A/µm

2.49 × 10−5 A/µm

RSD

7.75%

4.43%

Off-current (Ioff)

Mean

3.74 × 10−15 A/µm

6.08 × 10−15 A/µm

SD

4.89 × 10−15 A/µm

1.825 × 10−16 A/µm

RSD

130.7%

3.0%

Memory performances

Sensing margin (SM)

Mean

5.72 µA/µm

17.4 µA/µm

SD

1.44 µA/µm

2.54 µA/µm

RSD

25.2%

14.6%

Retention time (RT)

Mean

212 ms

200 ms

SD

116 ms

82 ms

RSD

54.7%

41%