Table 1 Chemical composition of the electroless copper plating bath.

From: Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Role in the bath

Chemical

Concentration

Main salt

CuSO4·5H2O

15 g/L

Complexing agent

EDTA 2Na

14.5 g/L

NaKC4H4O6·4H2O

14 g/L

Buffering agent

K4[Fe(CN)6]·3H2O

1 g/L

Reducing agent

NaBH4

2 g/L

PH adjuster

NaOH

Proper amount

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