Figure 8

(a) TEM (transmission electron microscope) images of solder joint after reflowing at 280 °C for 60 min, (b) TEM images at the Cu/Cu₃Sn interface. (c) The high-resolution images at the Cu/Cu₃Sn interface. (d) TEM images at the Cu/Cu₃Sn interface. (e) The high-resolution images of Cu₃Sn. (f) The high-resolution images at the Cu/Cu₃Sn interface. (g) The electron diffraction pattern of the interface. (h) The electron diffraction pattern of the Cu₃Sn. (i) The high-resolution image pattern of the Cu. (j) The electron diffraction pattern of the Cu₃Sn in the interface. (k) The high-resolution images at the Cu/Cu₃Sn interface. (l) The high-resolution images at the Cu/Cu₃Sn interface. (m) The high-resolution images at the Cu/Cu₃Sn interface. (n) The high-resolution images at the Cu/Cu₃Sn interface.