Figure 6
From: Bonding of PMMA to silicon by femtosecond laser pulses

Optical image of the silicon substrate after laser bonding, and being the PMMA removed (pulse energy 2.0 μJ with repetition rate 800 kHz, scan speed 1 mm/s).
From: Bonding of PMMA to silicon by femtosecond laser pulses

Optical image of the silicon substrate after laser bonding, and being the PMMA removed (pulse energy 2.0 μJ with repetition rate 800 kHz, scan speed 1 mm/s).