Figure 2
From: Transformation of bimetallic Ag–Cu thin films into plasmonically active composite nanostructures
(a) Temperature dependence of resistance for Ag thin films with thickness of 5 nm, 10 nm and 20 nm; (b) Temperature dependence of resistance for Ag–Cu thin film with a thickness of 10 nm; (c) Thickness dependence of the breaking of the electrical continuity for Ag, Cu and Ag–Cu thin films.
