Figure 1
From: Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures
(a) Initial microstructure of the layered Cu/Ta system with the KS orientation relationship. Here, purple, green, blue, red, and orange color atoms represent Ta-BCC, Cu-FCC, disordered, stacking fault, and Cu/Ta surface/void atoms, respectively. (b) The corresponding structure of the interface with the Z-stress values coloring the atoms. Here the misfit dislocations are shown by the dashed line.
