Figure 2
From: Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures
(a) Stress–strain plot for deformation of the Cu/Ta system in the direction perpendicular to the KS interface. (b) Distributions of stacking faults at the KS interface showing the plasticity contributions from different slip systems. Plots (c,d) show the evolution of dislocation density and the number of voids, respectively. Here, blue and orange dashed vertical lines at points A and B represent the void nucleation and peak number of voids points, respectively.
