Figure 3
From: Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures
Plots for (a) stress–strain behavior and (b) evolution of the number of voids during the uniaxial expansion of the un-deformed and pre-deformed KS interfaces loaded in the direction perpendicular to the interface. The blue and orange dashed vertical lines represent the void nucleation and peak number of voids points, respectively. Dislocation density evolution in the pre-deformed interface system during uniaxial expansion as observed in (c) the Cu layer and (d) the Ta layer.
