Figure 5
From: Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures
(a) Stress–strain plots for X [1\(\overline{1 }\! \overline{2 }\)], Y \([1\overline{1 }0]\)and Z [111] loading orientations for the KS interface. Here, blue and orange dashed vertical lines at points A and B represent the void nucleation and peak number of voids points, respectively. Snapshots of the KS interface showing the contributions from the slip systems when loaded in (b) the X direction and (c) the Y direction. The system snapshots show void distributions at point B when loaded in (b) the X direction and (c) the Y direction.
