Figure 6
From: Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures
(a) Stress–strain response of KS, KS112 and OT1 interface systems in [111], [112] and [110] loading directions, respectively. The evolution of (b) number of voids and (c) void fraction in KS, KS112 and OT1 interface structures. Here, blue and orange dashed vertical lines at points A and B represent the void nucleation and peak number of voids points, respectively. System microstructure at the time of maximum voids for the (d) in KS112 interface system, and (e) in the OT1 interface system. Here, purple, green, blue, red and orange atoms represent Ta-BCC, Cu-FCC, disordered atoms, stacking faults, Ta surface atoms, and voids in Cu, respectively.
