Table 1 Stacking fault atom fractions (%) of the four fcc slip systems in Cu at the void nucleation strain (Point A), \({SF}_{N}^{void}\), and at peak void number strain (Point B), \({SF}_{M}^{void}\), for loading in the direction perpendicular to the KS interface in the undeformed and pre-deformed system.
From: Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures
Slip plane | Undeformed Cu/Ta | Pre-deformed Cu/Ta | ||
|---|---|---|---|---|
\({SF}_{N}^{void}\) (%) | \({SF}_{M}^{void}\) (%) | \({SF}_{N}^{void}\) (%) | \({SF}_{M}^{void}\) (%) | |
\((111)\) | 0S, 0 | 0S, 0 | 7S, 0 | 1S, 0 |
\((\overline{1 }11)\) | 18P, 0.31 | 36P, 0.31 | 22P, 0.31 | 34P, 0.31 |
\((1\overline{1 }1)\) | 21P, 0.31 | 35P, 0.31 | 17P, 0.31 | 28P, 0.31 |
\((11\overline{1 })\) | 62P, 0.31 | 28P, 0.31 | 54P, 0.31 | 37P, 0.31 |
