Table 2 Stacking fault atom fractions (%) of the four fcc slip systems in Cu at the void nucleation strain (Point A), \({SF}_{N}^{void}\), and at peak void number strain (Point B), \({SF}_{M}^{void}\), for different loading directions in the KS interface in the undeformed and pre-deformed system.
From: Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures
Slip plane | \({SF}_{N}^{void}\) (%) | \({SF}_{M}^{void}\) (%) | ||||
|---|---|---|---|---|---|---|
KS_X | KS_Y | KS_Z | KS_X | KS_Y | KS_Z | |
\((111)\) | 0S, 0 | 0S, 0 | 0S, 0 | 3S, 0 | 0.6S, 0 | 0S, 0 |
\((\overline{1 }11)\) | 63P, 0.39 | 0.4P, 0.47 | 18P, 0.31 | 54P, 0.39 | 1.6P, 0.47 | 36P, 0.31 |
\((1\overline{1 }1)\) | 29P, 0.39 | 99.6P, 0.47 | 21P, 0.31 | 39P, 0.39 | 96.4P, 0.47 | 35P, 0.31 |
\((11\overline{1 })\) | 8S, 0.31 | 0S, 0 | 62P, 0.31 | 4S, 0.31 | 1.4S, 0 | 28P, 0.31 |
